Frequently Asked Questions

A

RFID nail tags, which are encapsulated in a hard shell, can be directly nailed into a variety of wooden items. Low frequency and high frequency, or ultralight frequency chip for option.<o:p>

A The factors need to consider as follows:
Application environment, temperature, humidity, indoor or outdoor use, pressure, and anti-collision.The material of the tracked object (such as metal, wood, plastic, carton, etc.), size, material, installation method, etc.
Electrical performance: reading and writing distance, direction, and group reading requirements.
Variable data, numbering, encoding, Logo printing, etc.

A

Products/ Features, craft	Thin flexible RFID tag	PVC/ABS Heat Lamination RFID tag	PET/PET-G Heat Lamination RFID tag	ABS housing Tag	PPS /Nylon/PC/ Shell Tag	Flexible On metal RFID
Merits	1, Mass production with low cost. 2, Fast production speed. 3, Easy to print.	1, Low cost and fast production. 2, Short time for custom antenna.  3, Low cost for custom molds. 4, Thermal fusion type, Robust structure suitable for RFID.	1, Low production, processing costs, fast production. 2, Short time for custom antenna. 3, Low cost for custom molds. 4, Strong glue is required for PET bonding	1, Especially suitable for harsh environments. 2, Various stereo shapes. 3, Custom transponder as project demand, good flexibility.	1, Especially suitable for harsh environments. 2, Various stereo shapes； 3, Custom transponder as project demand, good flexibility	1, Low cost compared to other anti-metal tags. 2, Printable. 3, Suitable for both metal and non-metal environment
Demerits	1, Not resistant to external impact, single-use. 2, Set up cost high. 3, High processing costs at less than 50k quantity. 4, Long time custom production.	1, Package in sheet only. 2, Not suitable for outdoor use and long-term immersion in liquid。 3, Weak advantage of the cost when a huge quantity.	1, Package in sheet only. 2, Not suitable for outdoor use and long-term immersion in liquid。 3, Weak advantage of the cost when a huge quantity.	1, Higher mold cost for new module. 2, Transponder need more manual work. 3, The volume and thickness are relatively large, and the thickness is not thinner than 2mm. 4, High cost for the new housing set up cost.	1, Higher mold cost for new module. 2, Transponder need more manual work. 3, The volume and thickness are relatively large, and the thickness is not thinner than 2mm. 4, High cost for the new housing set up cost.	1, Cannot be removed and pasted. 2, Can't resist strong impact；3, High cost compared to conventional labels
Cost	✩	✩✩	✩✩✩	✩✩✩✩	✩✩✩✩✩	✩✩✩
Transponder	Al etching antenna + FLIP die bonding	Copper wire winding antenna + COB, RFID etching inlay+ FLIP Bonding	Copper wire winding antenna + COB, RFID etching inlay+ FLIP Bonding	Copper wire winding antenna + COB, RFID etching inlay+ FLIP Bonding; PCB + SMT, Ceramic +SMT	Copper wire winding antenna + COB, RFID etching inlay+ FLIP Bonding, PCB + SMT, Ceramic +SMT	double layer Al etching antenna + FLIP die bonding
Min Size	Dia: 8mm	Diameter 15mm subject to minimum copper antenna size	Diameter 15mm subject to minimum copper antenna size	Diameter 12,    thickness 2.5mm	Diameter 16, thickness 2.5mm	51x15 x 1.1mm,
IP	IP56-IP64	IP65	IP65	IP69	IP69	IP 67
Adapt to the temperature range	-20 to +80 C	-20 to +65(ABS,PET)	-20 to +95(ABS,PET)	from -30 to +180 Celsius degree	from -30 to +180 Celsius degree	-20 to +80 C
Logo printing	Offset Printing	offset printing, silk-screen printing, laser logo printing	offset printing, silk-screen printing, laser logo printing	Pad printing, embossing or debossing on mold cast, laser engrave	Pad printing, embossing or debossing on mold cast, laser engrave	Offset printing
Printing and variable data	Thermal Transfer	laser engraved, laser-luminescence lD number, chip encodable	laser engraved, laser-luminescence lD number, chip encodable	laser engraved lD number, chip encodable	laser engraved lD number, chip encodable	Thermal Transfer
Anti-collision characteristics	✩	✩✩	✩✩✩	✩✩✩✩	✩✩✩✩	✩✩
Installation	self-adhesive	self-adhesive, screw, Rivet, hanging, insert	self-adhesive, screw, Rivet, hanging, insert	self-adhesive, screw, Rivet, insert	self-adhesive, screw, Rivet, insert	self-adhesive
Outdoor use or not	NA	short time	short time	Could be	Could be	NA
Service life	1 year	2-3years	2-3years	1-5 years	1-5 years	2Years

A The factors need to consider to emulate the cost of products, durability of tag, the performance of the tag.

Type	Merits	Demerits	Cost	Antenna	Chip packaging	Bonding
Contactless card & Tag	Flexible customized size, /low MOQ for customization,	speed of production lower than roll to roll flexible RFID tag	✩✩	Copper wire	COB, chip Module for cards	Spot welded
Flexible RFID inlay in roll	speed production.	High setup cost, MOQ high, fragile.	✩	Al etching	Bare bumped chip	FLIP bonding
PI Tag	speed production. Heat/Cold resistant, stability	High setup cost, MOQ high, fragile.	✩✩✩	Al etching	Bare bumped chip	FLIP bonding
PCB Tag	Good performance and stable structure	high set up cost,	✩✩✩✩	Cu etching	QFN, SOP etc.	SMT, wire bonding
Ceramic Tag	Best e-performance,	High cost, fragile. Easy oxidation	✩✩✩✩✩	Ag printing	QFN, SOP	SMT

A -COB is in short of “chip on board”, with wire bonding realize its electrical connection.
-QFN（Quad Flat No-lead Package）is one of the surface-mount form packages. Small size, lightweight, outstanding electrical and thermal properties make this package ideal for any application that high requires size, weight, and performance.
-SOT (Small Outline Transistor) is one of the surface-mount form packages. Its advantage is that it can better dissipate heat from the chip in the package. SOT encapsulation leads with high efficiency, consistency, reliability, and cost. At present, it is still the inevitable choice for space restriction, providing innovation basis and driving force for automobile, consumption, computer, and industrial application.
-Cost comparison for each encapsulation: COB˂QFN ˂ SOT.
-COB encapsulation can be applied to many application environments.
-RFID tag with QFN or SOT encapsulation ideal works in a harsh working environment, such as high pressure, high temperature, etc.