A -COB is in short of “chip on board”, with wire bonding realize its electrical connection.
-QFN(Quad Flat No-lead Package)is one of the surface-mount form packages. Small size, lightweight, outstanding electrical and thermal properties make this package ideal for any application that high requires size, weight, and performance.
-SOT (Small Outline Transistor) is one of the surface-mount form packages. Its advantage is that it can better dissipate heat from the chip in the package. SOT encapsulation leads with high efficiency, consistency, reliability, and cost. At present, it is still the inevitable choice for space restriction, providing innovation basis and driving force for automobile, consumption, computer, and industrial application.
-Cost comparison for each encapsulation: COB˂QFN ˂ SOT.
-COB encapsulation can be applied to many application environments.
-RFID tag with QFN or SOT encapsulation ideal works in a harsh working environment, such as high pressure, high temperature, etc.